What are the benefits of touching the switch with the patch?

来源:Dongguan Yanghan Industrial Co., Ltd.  时间:2020-11-27

Multiple benefits of patch touch switch

Appearance and structure of the product:

Patch touch switch is one of the light touch switches, all of its product operating principles are the same. The appearance structure of the patch type and the plug-in type has its own. The base of the product is 90 ° to the pin. It is necessary for the pin to be flat, and the pitch of each pin is the same. This is the SMD type. The low seat of the product and the pin form 180 ° and the shape of the pin is bent inward to ensure that the plug-in board will not fall off. This is the plug-in type. The patch type is shown on the left, and the plug-in type is shown on the right.

Multiple benefits of the product:

This product is suitable for reflow soldering because it belongs to the patch method. The benefits of reflow soldering: 1) when reflow soldering technology is used, printed circuit boards do not need to be immersed in molten soldering, but partial heating method is used to complete the welding mission; therefore, the soldered components are subject to less thermal shock and will not be damaged due to overheating. 2) Because in the welding technology, only need to apply solder in the welding part, and part of the welding is heated, so the welding defects such as bridge are avoided. 3) In reflow soldering technology, solder is only used once, there is no re-use of the situation, so the solder is very pure, no impurities, to ensure the quality of solder joints. The SMT touch switch cooperates with the reflow soldering process, which can reduce the production power, reduce the labor cost, reduce the defect rate and save the cost. Chip type switch, it is necessary to use tape packaging, can travel product sealing and preservation. There are many benefits!

Material requirements of products:

Reflow soldering is normally a 7-Stage temperature process,  touch switch to cooperate with the production process, and the material of the product should also meet the requirements of the production process. The highest temperature point of reflow soldering is 260 ° and the plastic material of the switch should also reach 260 ° to ensure its native temperature resistance.  Reflow soldering is the selection of machine suction production process, the switch pin is necessary to adhere to flatness, the pin is necessary to ensure that tin can eat, the pin can not be oxidized, so to ensure the solderability of the product. It is better to use copper silver plating process for switch pin material, and the electroplating is better to be above 0.3um.

Types of products:

Our products are diversified. According to different application environment and structure, different types of products are developed. There are many kinds of products with various shapes, such as ultra-thin patch type, side by side patch type, waterproof patch type, patch with bracket type, patch with lamp type, patch dust-proof type, etc. There are many kinds of product standards. I will not introduce them one by one here.

Application scale of the product:

Medical equipment, smart watch, tablet computer, wearable equipment, digital products, color TV, black and white TV, audio equipment, video recorder, camera, computer, game machine, fax machine, walkie talkie, baton, machine tool control equipment, copying, printer, electronic instrument, surface and other household appliances.

Purchase instructions and precautions:

 touch switch of good or bad, will directly affect the production process and product quality after all. Therefore, we should pay attention to both the purchase and application. Before purchasing, it is necessary for us to understand the temperature resistance, weldability, appearance of the product, whether the tape packing of the product is just tight, the difference in hand feeling, and the concave convex life of the product. In production, it is necessary to pay attention to the problems such as whether the reflow temperature curve is reasonable, whether the thickness of PCB solder paste is uniform, whether the flux can not be excessive, whether the switch handle is not enough, whether there are errors in machine programming, etc?